天津大学教师个人主页系统杜伯学 [44] B. X. Du and Bin Cui: Effects of Thermal Conductivity on Dielectric Breakdown of Micro, Nano Sized BN Filled Polypropylene Composites. IEEE Transactions on Dielectrics and Electrical Insulation, 23(4): 2116-2125 (2016) 中文主页

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杜伯学

教师拼音名称：Professor Boxue Du
性别：男
职称：教授
所属院系：电气自动化与信息工程学院

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Current position:: 中文主页 >> 学术成就 >> 论文成果

[44] B. X. Du and Bin Cui: Effects of Thermal Conductivity on Dielectric Breakdown of Micro, Nano Sized BN Filled Polypropylene Composites. IEEE Transactions on Dielectrics and Electrical Insulation, 23(4): 2116-2125 (2016)

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上一条:[43] B. X. Du, J. P. Jiang, J. G. Zhang and D. S. Liu: Dynamic Behavior of Surface Charge on Double-layer Oil-paper Insulation under Pulse Voltage. IEEE Transactions on Dielectrics and Electrical Insulation, 23(5): 2712-2719 (2016).

下一条:[45] B. X. Du, Bin Cui and Meng Xiao:Thermal Conductivity and Arcing Resistance of Micro or hybrid BN Filled Polyethylene under Pulse Strength. IEEE Transactions on Dielectrics and Electrical Insulation, 23(5): 3061-3170 (2016).