Areas of research interest

Materials, Processing and Reliability Study on Electronic Packaging; Corrosion, Fatigue and Fracture behavior of Welded Joints

Teaching

Non Distructive Testing

Honors and awards

[1] Ministry of Education of China 2010 Scientific and Technological Progress Award First Prize of (Project Name:Integrity evaluation technology and its application on large welded structures based on the local approach;The fifth contributor)

[2] 2007 Tianjin Scientific and Technological Progress Award Second Prize(Project Name:Integrity assessment method and application of pressure-bearing structure containing defects in power systems;The fifth contributor)

Selected publications (Journal articles, patents and books)

Journal Papers:

[1] Y.D. Han, S.M.L. Nai, H.Y. Jing, L.Y. Xu, C.M. Tan, J. Wei, Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes. Journal of Materials Science: Materials in Electronics, Vol. 22(3), 215-222(SCI).

[2] Y.D. Han, H.Y. Jing, S.M.L. Nai, C.M. Tan, J. Wei, et al. A new constitutive model for creep of Sn-Ag-Cu solder joints. Journal of Physics D: Applied Physics, Vol. 42, 2009, 125411 (SCI).

[3] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder. Journal of Electronic Materials, Vol. 39, No. 2, 2010, 223-229 (SCI).

[4] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Indentation size effect on the creep behavior of a Sn-Ag-Cu lead free solder. International Journal of Modern Physics B, Vol. 24, Nos.1-2, 2010, 267-275 (SCI).

[5] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes. International Journal of Nanoscience, Vol. 9, No.4, 2010, 283-287 (EI).

[6] Han Yong-dian, Jing Hong-yang, Xu Lian-yong, Wei Jun, et al. Optimal design of SnAgCu-CNT solder lap-shear specimen under thermal cycles with FEM. Journal of Shanghai Jiaotong Univeristy (Science). Vol. 13(suppl), 2008, 76-79 (EI).

[7] Han Yongdian, Jing Hongyang, Xu Lianyong, Wei Jun, Wang Zhongxing, Numerical simulation of creep behavior of SnAgCu-CNT lap shear solder under thermal cycles,Transactions of the China Welding Institution, Vol. 28, No.11, 2007, 85-88+92 (EI).

Conference Papers:

[1] Y.D. Han, C.M. Tan, S.M.L. Nai, L.Y. Xu, H.Y. Jing, J. Wei, Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder. 60th Electronic Components and Technology Conference. 1-4 June, 2010, Las Vegas, Nevada, USA, 979-984 (EI).

[2] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Indentation Creep and hardness of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes. 3rd IEEE International NanoElectronics Conference. 3-8 January, 2010, Hong Kong, China, 219-221(EI).

[3] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Effect of Ni-Coated Carbon Nanotubes on Interfacial Intermetallic Layer Growth. 11th Electronics Packaging Technology Conference. 9-11 December 2009, Singapore, 292-295 (EI).

[4] Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, Indentation size effect on the hardness of a Sn-Ag-Cu solder. ASME International Mechanical Engineering Congress and Exposition. 13-19 November, 2009, Lake Buena Vista, Florida, USA, 137-141 (EI).

[5] Y.D. Han, H.Y. Jing, S.M.L. Nai, C.M. Tan, J. Wei, et al. A new creep model for SnAgCu lead-free composite solders: incorporating back stress. 10th Electronics Packaging Technology Conference. 9-12 December 2008, Singapore, 689-695 (EI).

Social Appointments

Reviewer of Microelectronic Engineering and Journal of Materials Science

• Materials, Processing and Reliability Study on Electronic Packaging; Corrosion, Fatigue and Fracture behavior of Welded Joints

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