天津大学教师个人主页系统陈刚 Mei YH, Chen G*, Li X, Lu GQ, Chen X. Evolution of Curvature under Thermal Cycling in Sandwich Assembly Bonded by Sintered Nano-silver Paste, Soldering & Surface Mount Technology. 2013; 25(2): 107-116. (★/◆) IF: 0.913 Personal Profile

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Chen Gang

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School of Chemical Engineering and Technology

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Professor

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Selected Papers

Current position: Personal Profile > Academic Achievements > Selected Papers

Mei YH, Chen G*, Li X, Lu GQ, Chen X. Evolution of Curvature under Thermal Cycling in Sandwich Assembly Bonded by Sintered Nano-silver Paste, Soldering & Surface Mount Technology. 2013; 25(2): 107-116. (★/◆) IF: 0.913

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Pre One:Chen G, Zhang ZS, Mei YH*, Li X, Lu GQ, Chen X. Ratcheting Behavior of Sandwiched Assembly Joined by Sintered Nanosilver for Power Electronics Packaging. Microelectronics Reliability. 2013; 53(4): 645-651. (★/◆) IF: 1.202

Next One:Wen MJ, Li H, Yu DJ, Chen G*, Chen X. Uniaxial ratcheting behavior of Zircaloy-4 tubes at room temperature. Materials & Design. 2013; 46, 426-434. (★/◆) IF: 3.997