天津大学教师个人主页系统陈刚 Mei YH, Cao YJ, Chen G*, Li X, Lu GQ, Chen X. Characterization and Reliability of Sinter Nanosilver Joints by A Rapid Current-Assisted Method for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2014; 14(1): 262-267. (★/◆) IF: 1.437 Personal Profile

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Chen Gang

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School of Chemical Engineering and Technology

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Professor

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Selected Papers

Current position: Personal Profile > Academic Achievements > Selected Papers

Mei YH, Cao YJ, Chen G*, Li X, Lu GQ, Chen X. Characterization and Reliability of Sinter Nanosilver Joints by A Rapid Current-Assisted Method for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2014; 14(1): 262-267. (★/◆) IF: 1.437

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Pre One:Chen G, Yu L, Mei YH*, Li X, Lu GQ, Chen X. Uniaxial Ratcheting Behavior of Sintered Nanosilver Joint for Electronic Packaging. Materials Science & Engineering A. 2014; 591: 121-129. (★/◆)

Next One:Li X, Chen G*, Wang L, Mei YH, Chen X, Lu GQ. Creep Properties of Low-Temperature Sintered Nano-Silver Lap Shear Joints. Materials Science & Engineering A. 2013; 579: 108-113. (★/◆)