Areas of research interest

1. Undwater welding technology;
2. Brazing Processing and Brazing Flux for Moderate Temperature Aluminum Alloys;
3. Advanced Joining Methods.

Teaching

1. Modern Arc Welding Power Source(Undergraduate);
2. Introduction of Manufacture Technology(Undergraduate);
3. (Graduate)

Selected publications(Journal articles, patents and books)

1. Fangjie CHENG, Hiroshi NISIKAWA, Tadashi TAKEMOTO,The Microstructure Characterization of Sn-Ag-Cu Solder with Small Amount of Co addition,13th Microjoining and assembly technology in electronics (Mate2007),Vol.13,2007,p193-196.
2. Fangjie CHENG, Hiroshi NISIKAWA, Tadashi TAKEMOTO,Effects of Isothermal Aging on the Microstructure and Tensile Behavior of Sn-3.0Ag-0.5Cu-0.2Co Solder,International welding and joining conference (IWJC-Korea2007),Mater. Sci. Forum (Advanced welding and micro joining/packaging for the 21st century), vol. 580-582, p239-242.
3. Fangjie CHENG, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Effects of Co Addition on the Microstructure and Tensile behavior of Sn-3.0Ag-0.5Cu Solder Alloy, Transactions of JWRI, Vol.36, No.1, 2007,p53-56.
4. Feng GAO, Fangjie CHENG, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Characterization of Co-Sn Intermetallica Compounds in Sn-3.0Ag-0.5Cu-0.5Co Lead-free Solder Alloy, Mater. Lett.62 (2008), p2257-2259.
5. Fangjie CHENG, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni-Bearing SAC305 Lead-Free Solders by the Strain Rate Change Tensile Test Method. Mater. Trans. Vol.49, No.07 (2008) p.1503-1507.
6. Fangjie CHENG, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Microstructural and Mechanical Properties of the SAC305 Solder Alloys Modified by the Dual Addition of Co-Ni, For the SPT'07 international conference. Accept by the High Temperature Society of Japan.
7. Fangjie CHENG, Hiroshi NISIKAWA, Tadashi TAKEMOTO, Microstructure and Mechanical Properties of Sn-Ag-Cu Lead-Free Solder with Minor Addition of Co and Ni,J. Mater. Sci,(2008), vol.43,p.3643-3648.
8. Fangjie CHENG, Feng Gao, Hiroshi NISHIKAWA and Tadashi TAKEMOTO, Interaction Behavior Between the Additives and Sn in Sn-3.0Ag-0.5Cu-based Solder Alloys and the Relevant Joint Solderability. J. of Alloys and Compounds. (2008) Doi:10.1016/j.jallcom.05.017.
9. Fangjie CHENG, Feng Gao, Jianyou Zhang etal. Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys. J.Mater Sci (2011)46:3424-3429.
10. Fangjie CHENG, Jianyou Zhang, Shensun Hu, Ping Shang. Numerical simulation on nugget formation and evolution in welding of Aluminum alloy. Transactions of Tianjin University. (2011), Vol.17, No.1. P.28-32.