School of Microelectronics
Lecturer
hpfu@tju.edu.cn
Room 102, Building Block 26D, Tianjin University, 92 Weijin Road, Nankai district, Tianjin
Hai-Peng Fu (S’06–M’12) received the B.S. degree in communication engineering from Harbin Institute of Technology, Harbin, China, in 2003, and the M.S. degree from the Royal Institute of Technology, Stockholm, Sweden, in 2010, and Ph.D. degrees in electrical engineering from Fudan University, Shanghai, China, in 2012. He is currently a lecturer with the School of Electronic Information Engineering, Tianjin University. His research interests are RF integrated circuits (RFICs) and RF integrated systems for wireless, Microwave device characterization modeling, monolithic microwave integrated circuit (MMIC), reliability physics modeling of electronic components and systems.
He presides over 10 research projects of China, the projects
amount is more than 5 million RMB. He has published more than 35
papers in International journal and society (20 papers as the first
author or corresponding author), including IEEE Transactions on Microwave Theory and Techniques, etc., among which 20 papers are included in
SCI (16 papers as the first author or corresponding author) .
- Doctor of Science| Fudan University| Microelectronics| 2012
- Millimeterwave and Terahertz Integrated Circuit and System Design
- Radio Frequency Integrated Circuit Design
- Power Device Characterizaiton and Modeling
- Radio Frequency Integrated Circuit Reliability
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2015.6-2019.12
 Tianjin University | Lecturer  -
2013.1-2015.6
 Tianjin University | PostDoctor  -
2011.6-2012.10
 Nanyang Technological University | Research Staff 
- Papers
- [1] 10. Cheng-Yu Zhang, Hai-Peng Fu, Yuan-Yuan Zhu, Jian-Guo Ma, Qi-Jun Zhang, “A hybrid model of III-V FETs with accurate high-order derivatives,” IEICE Electronics Express, vol. 14, no. 12, 2017.
- [2] 9. Qian-Fu Cheng, Hai-Peng Fu, Shou-Kui Zhu, Hai-Feng Wu and Jian-Guo Ma, “High-efficiency GaN class-F/ calss-F-1 power amplifiers with distributed L-shaped parasitic-compensation circuit,” Microwave and Optical Technology Letters, vol. 57, no. 10, pp. 2441-2445, 2015.
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- [3] 8. Qian Lin, Hai-Peng Fu, Qian-Fu Cheng, and Yuan-Yuan Zhu, “Study of the index failure for power amplifier caused by temperature,” Analog Integrated Circuits and Signal Processing, vol. 89, no. 1, pp. 177-183, 2016.
- [4] 7. Jun-Jie Gu,Hai-Peng Fu,Wei-Cong Na,Qi-Jun Zhang,Jian-Guo Ma, “Fast and Automated Electromigration Analysis for CMOS RF PA Design,” Journal of Electronic Testing-Theory and Applications, vol. 33, no. 1, pp. 133-140, 2017.
- [5] 6. Yuan-Yuan Zhu, Jian-Guo Ma, Hai-Peng Fu, Qi-Jun Zhang, Qian-Fu Cheng and Qian Lin, “Accurate modeling of pHEMT output current derivaties over a wide temperature range,” International Journal of Numerical Modeling: Electronic Networks, Devices and Fields, vol. 30, no. 3-4, 2017.
- [6] 5. Qian-Fu Cheng, Hai-Peng Fu, Shou-Kui Zhu, and Jian-Guo Ma, “Novel dual-band matching network for concurrent dual-band power amplifier applications,” Microwave and Optical Technology Letters, vol. 57, no. 7, pp. 1597-1600, July 2015.
- [7] 4. Qian-Fu Cheng, Hai-Peng Fu, Shou-Kui Zhu, and Chang Liu, “Comments on ‘Design of Highly Efficient Broadband Class-E Power Amplifier Using Synthesized Low-Pass Matching Networks’,” IEEE Transactions on Microwave Theory and Techniques, vol. 64, no. 5, pp. 1678-1678, Apr. 2016.
- [8] 3. Hai-Feng Wu, Qian-Fu Cheng, Xu-Guang Li, and Hai-Peng Fu, “Analysis and Design of an Ultrabroadband Stacked Power Amplifier in CMOS Technology,” IEEE Transactions on Circuits and Systems II: Express Briefs, vol. 63, no. 1, pp. 49-43, Jan. 2016.
- [9] 2. Xiang-Dong Huang,Rui-Peng Bai,Xu-Kang Jin,Hai-Peng Fu, “Robust and Efficient Frequency Estimator for Undersampled Waveforms Based on Frequency Offset Recognition,” Plos One, vol. 11, no. 10, pp. 133-141, 2016.
- [10] 1. Qian-Fu Cheng, Hai-Peng Fu, Shou-Kui Zhu, and Jian-Guo Ma, “Two-Stage High-Efficiency Concurrent Dual-Band Harmonic-Tuned Power Amplifier,” IEEE Transactions on Microwave Theory and Techniques, vol. 64, no. 10, pp. 3232-3243, Aug. 2016.