天津大学教师个人主页系统王福军 Wang F., Zhao X., Zhang D., Wu Y. (2012): The ultrasonic transducer for microelectronics wire bonder with multi-frequency, Chinese Patent (Patent No ZL200910245182.8). Personal Profile

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Fujun Wang

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School of Mechanical Engineering

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Associate professor

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Mechanical Engineering

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Wang F., Zhao X., Zhang D., Wu Y. (2012): The ultrasonic transducer for microelectronics wire bonder with multi-frequency, Chinese Patent (Patent No ZL200910245182.8).

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Service Invention or Not:no

Pre One:Yuan Y., Jing X., Fang H., Zhang D., Wang F. (2015): A 2D ultrasonic vibration stage, Submitted as: Chinese Patent (Application No: 2015100118652, application date 10. 2015)