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Kaixiang Peng, Yongtao Ma, Ce Zeng and Le Dong, Modeling and Optimization of Coaxial Annular Through Silicon Via Based on a Temperature Range, 2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024, doi: 10.1109/ICEPT63120.2024.10668420.

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Title of Paper:Kaixiang Peng, Yongtao Ma, Ce Zeng and Le Dong, Modeling and Optimization of Coaxial Annular Through Silicon Via Based on a Temperature Range, 2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024, doi: 10.1109/ICEPT63120.2024.10668420.

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Next One:H. Fu, Yongtao Ma, Device-Free Multitarget Localization With Weighted Intersection Multidimensional Feature for Passive UHF RFID, IEEE Sensors Journal, vol. 22, no. 7, pp. 7300-7310, 1 April1, 2022.

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