天津大学教师个人主页系统杜伯学 [44] B. X. Du and Bin Cui: Effects of Thermal Conductivity on Dielectric Breakdown of Micro, Nano Sized BN Filled Polypropylene Composites. IEEE Transactions on Dielectrics and Electrical Insulation, 23(4): 2116-2125 (2016) Personal Profile

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Professor Boxue Du

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School of Electrical and Information Engineering

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Professor

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Electrical Engineering

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Current position: Personal Profile > Academic Achievements > Selected Papers

[44] B. X. Du and Bin Cui: Effects of Thermal Conductivity on Dielectric Breakdown of Micro, Nano Sized BN Filled Polypropylene Composites. IEEE Transactions on Dielectrics and Electrical Insulation, 23(4): 2116-2125 (2016)

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Pre One:[43] B. X. Du, J. P. Jiang, J. G. Zhang and D. S. Liu: Dynamic Behavior of Surface Charge on Double-layer Oil-paper Insulation under Pulse Voltage. IEEE Transactions on Dielectrics and Electrical Insulation, 23(5): 2712-2719 (2016).

Next One:[45] B. X. Du, Bin Cui and Meng Xiao:Thermal Conductivity and Arcing Resistance of Micro or hybrid BN Filled Polyethylene under Pulse Strength. IEEE Transactions on Dielectrics and Electrical Insulation, 23(5): 3061-3170 (2016).