李玲霞
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一种低温烧结低损耗微波介质陶瓷材料
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Affilication of Author(s):天津大学

School Sign:天津大学

Type of Patent:Invent

Type of Patent:Authorized patents

Application Number:CN201410166373.6

Authorization number:ZL201410166373.6.

Number of Inventors:6

Service Invention or Not:no

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Address: No. 92, Weijin Road, Nankai District, Tianjin Zip Code: 300072

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