天津大学教师个人主页系统周伟 60. X. Sa, W. Zhou, P. Wu, Electromigration in Cu-Cored Sn-3.5 Ag-0.7 Cu Solder Interconnects Under Current Stressing, Journal of electronic materials 43(4) (2014) 1144. Personal Profile

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Zhou Wei

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School of Science

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Associate professor

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Selected Papers

Current position: Personal Profile > Academic Achievements > Selected Papers

60. X. Sa, W. Zhou, P. Wu, Electromigration in Cu-Cored Sn-3.5 Ag-0.7 Cu Solder Interconnects Under Current Stressing, Journal of electronic materials 43(4) (2014) 1144.

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Pre One:59. J. Wang, W. Zhou, P. Wu, Band gap widening and d 0 ferromagnetism in epitaxial Li-doped SnO 2 films, Applied Surface Science 314 (2014) 188-192.

Next One:61. W. Mu, W. Zhou, B. Li, P. Wu, Janus-faced Cu-core periphery formation and Bi phase redistribution under current stressing in Cu-cored Sn58Bi solder joints, Journal of Alloys and Compounds 584 (2014) 483-486.