Mei YH, Wang T, Cao X, Chen G*, Lu GQ, Chen X. Transient Thermal Impedance Measurement on Low-Temperature Sintered Nano-silver Joints. Journal of Electronic Materials. 2012; 41 (11) : 3152-3160. (★/◆)
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上一条:Li X, Chen G*, Chen X, Lu GQ, Wang L, Mei YH. High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. Microelectronics Reliability. 2013; 53(1): 174-181. (★/◆)
下一条:Chen G, Cao YJ, Mei YH*, Han D, Li X, Lu GQ, Chen X. Pressures-Assisted Low-Temperature Sintering of Nanosilver Paste for 5×5 mm2 Chip Attachment, IEEE Transactions on Components and Packaging Technology. 2012; 2 (11): 1759-1767. (★/◆) IF: 1.151
