School of Chemical Engineering and Technology
Professor
022-27408399
agang@tju.edu.cn
50-C113, School of Chemical Engineering and Technology, Tianjin University
Gang Chen received the Ph.D. degree in Chemical Process Machinery from Tianjin University, China, in 2006. His main research field is mechanical behavior of materials, low cycle fatigue, creep, creep-fatigue, finite element analysis and constitutive modeling for electronic and conventional structural materials. He has published over 80 papers in SCI journals and been cited more than 400 times in SCI database. Dr. Chen is a Fellow of Fatigue Institution, Chinese Materials Research Society. He is also an IEEE Member. Dr. Chen has been awarded as “New Century Excellent Talents in University”, Ministry of Education of China, in 2013, “Young Excellent Technological Innovation Talents”, Tianjin Government of China, in 2014.
- Doctoral degree| Tianjin University| Chemical Process Machinery| 2006
- Bachelor’s Degree| Heibei University of Technology| Chemical Machinery| 2001
- Low-cycle fatigue
- Structural integrity analysis
- Finite element analysis and constitutive modeling
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2006.3-2019.12
 School of Chemical Engineering and Technology 
- Papers
- [1] Chen G,Gao JW, Cui Y, Gao H, Guo X, Wu SZ. Effects of strain rate on the low cycle fatigue behavior of AZ31B magnesium alloy processed by SMAT. Journal of Alloys and Compounds, 2018; In press. (★/◆) IF:3.133
- [2] Wang XJ, Xu DK, Wu RZ, Chen XB, Peng QM, Jin L, Xin YC, Zhang ZQ, Liu Y, Chen XH, Chen G, Deng KK, Wang HY ( All authors contribute equally to this work). What is going on in magnesium alloys?Journal of Materials Science & Technology, 2017; In press. (★/◆) IF: 2.764
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- [3] Chen G, Ren JN, Gao H, Cui Y, Chen X. Pseudoelastic and corrosion behaviors of Mg ZEK100 alloy under cyclic loading. International Journal of Fatigue, 2017; 103: 466-477. (★/◆) IF: 2.899
- [4] Lin Q, Shi SW, Wang L, Chen S, Chen X, Chen G*. In-plane Biaxial Cyclic Mechanical Behavior of Proton Exchange Membranes. Journal of Power Sources, 2017; 360: 495-503. (★/◆) IF: 6.333
- [5] Chen G*, Zhao XC, Wu H. A critical review of constitutive models for solders in electronic packaging. Advances in Mechanical Engineering, 2017; 9(8): 1-21. IF: 0.827
- [6] Chen G*, Xu C, Qu H, Chen X. Ratcheting behavior of zirconium alloy tubes under combined cyclic axial load and internal pressure at 350 °C, Journal of Nuclear Materials, 2017; 491: 138-148. (★/◆) IF: 2.048.
- [7] Chen G, Zhang X, Xu DK, Li DH, Chen X, Zhang Z*, Multiaxial ratcheting behavior of zirconium alloy tubes under combined cyclic axial load and internal pressure, Journal of Nuclear Materials, 2017; 489: 99-108. (★/◆) IF: 2.048.
- [8] Chen G, Wu H, Gao JW, Lin Q*, Development of high-frequency and large-stroke fatigue testing system for rubber, Review of Scientific Instruments, 2017; 88(4): 045113. (★/◆) IF: 1.336.
- [9] Shi LT, Mei YH, Chen G*, Chen X. In Situ X-Ray Observation and Simulation of Ratcheting-Fatigue Interactions in Solder Joints, Electronic Materials Letters, 2017; 13(1): 97-106. (★/◆) IF: 2.057.
- [10] Chen G*, Zhang Y, Xu DK, Lin YC, Chen X, Low Cycle Fatigue and Creep-Fatigue Interaction Behavior of Nickel-Base Superalloy GH4169 at Elevated Temperature of 650 oC, Materials Science & Engineering A. 2016; 655: 175-182. (★/◆) IF: 2.647
- [11] Chen G*, Lin Q, Chen S, Chen X, In-plane biaxial ratcheting behavior of PVDF UF membrane, Polymer Testing, 2016; 50: 41-48. (★/◆) IF: 2.35
- [12] Chen G*, Lu LT, Cui Y, Xing RS, Gao H, Chen X, Ratcheting and fatigue characterizations for extruded AZ31B Mg alloy with and without corrosion environment, International Journal of Fatigue, 2015; 80: 364-371. (★/◆) IF: 2.899
- [13] Chen G, Cui SB, You L, Li Y, Mei YH*, Chen X, Experimental study on multi-step creep properties of rat skins, Journal of the Mechanical Behavior of Biomedical Materials. 2015; 46: 49-58. (★/◆) IF: 2.876
- [14] Liang T, Chen X, Cheng HC, Chen G*, Ling X, Thermal aging effect on the ratcheting-fatigue behavior of Z2CND18.12N stainless steel. International Journal of Fatigue, 2015; 72: 19-26. (★/◆) IF: 2.162
- [15] Chen G, Liang HQ, Wang L, Mei YH*, Chen X. Multiaxial ratcheting-fatigue interaction on acrylonitrile-butadiene-styrene terpolymer (ABS). Polymer Engineering and Science. 2015; 55 (3): 664-671. (★/◆) IF: 1.719
- [16] Wang L, Chen G*, Zhu JB, Sun XH, Mei YH, Chen X, Bending ratcheting behavior of pressurized straight Z2CND18.12N stainless steel pipe. Structural Engineering and Mechanics, An International Journal. 2014; 52 (6): 1135-1156. (★/◆) IF: 1.021
- [17] Chen G, Zhang ZS, Mei YH*, Li X, Yu DJ, Wang L, Chen X. Applying Viscoplastic Constitutive Models to Predict Ratcheting Behavior of Sintered Nanosilver Lap-Shear Joint. Mechanics of Materials. 2014; 72: 61-71. (★/◆) IF: 2.636
- [18] Chen G, Yu L, Mei YH*, Li X, Chen X, Lu GQ. Reliability Comparison between SAC305 Joint and Sintered Nanosilver Joint at High Temperatures for Power Electronic Packaging. Journal of Materials Processing Technology. 2014; 214(9): 1900-1908. (★/◆) IF: 2.359
- [19] Fu SC, Gao H, Chen G*, Gao LL, Chen X. Deterioration of mechanical properties for pre-corroded AZ31 sheet in simulated physiological environment. Materials Science & Engineering A. 2014; 593: 153-162. (★/◆)
- [20] Chen G, Yu L, Mei YH*, Li X, Lu GQ, Chen X. Uniaxial Ratcheting Behavior of Sintered Nanosilver Joint for Electronic Packaging. Materials Science & Engineering A. 2014; 591: 121-129. (★/◆)
- [21] Mei YH, Cao YJ, Chen G*, Li X, Lu GQ, Chen X. Characterization and Reliability of Sinter Nanosilver Joints by A Rapid Current-Assisted Method for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2014; 14(1): 262-267. (★/◆) IF: 1.437
- [22] Li X, Chen G*, Wang L, Mei YH, Chen X, Lu GQ. Creep Properties of Low-Temperature Sintered Nano-Silver Lap Shear Joints. Materials Science & Engineering A. 2013; 579: 108-113. (★/◆)
- [23] Mei YH, Chen G*, Cao YJ, Li X, Han D, Chen X. Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging. Journal of Electronic Materials, 2013; 42(6): 1209-1218. (★/◆) IF: 1.491
- [24] Mei YH, Cao YJ, Chen G*, Li X, Lu GQ, Chen X. Rapid Sintering Nanosilver Joint by Pulse-Current for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2013;13(1): 258-265. (★/◆)
- [25] Chen G, Zhang ZS, Mei YH*, Li X, Lu GQ, Chen X. Ratcheting Behavior of Sandwiched Assembly Joined by Sintered Nanosilver for Power Electronics Packaging. Microelectronics Reliability. 2013; 53(4): 645-651. (★/◆) IF: 1.202
- [26] Mei YH, Chen G*, Li X, Lu GQ, Chen X. Evolution of Curvature under Thermal Cycling in Sandwich Assembly Bonded by Sintered Nano-silver Paste, Soldering & Surface Mount Technology. 2013; 25(2): 107-116. (★/◆) IF: 0.913
- [27] Wen MJ, Li H, Yu DJ, Chen G*, Chen X. Uniaxial ratcheting behavior of Zircaloy-4 tubes at room temperature. Materials & Design. 2013; 46, 426-434. (★/◆) IF: 3.997
- [28] Li X, Chen G*, Chen X, Lu GQ, Wang L, Mei YH. High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. Microelectronics Reliability. 2013; 53(1): 174-181. (★/◆)
- [29] Mei YH, Wang T, Cao X, Chen G*, Lu GQ, Chen X. Transient Thermal Impedance Measurement on Low-Temperature Sintered Nano-silver Joints. Journal of Electronic Materials. 2012; 41 (11) : 3152-3160. (★/◆)
- [30] Chen G, Cao YJ, Mei YH*, Han D, Li X, Lu GQ, Chen X. Pressures-Assisted Low-Temperature Sintering of Nanosilver Paste for 5×5 mm2 Chip Attachment, IEEE Transactions on Components and Packaging Technology. 2012; 2 (11): 1759-1767. (★/◆) IF: 1.151
- [31] Li X, Chen G*, Chen X, Lu GQ, Wang L, Mei YH. Mechanical Property Evaluation of Nano-Silver Paste Sintered Joint Using Lap-Shear Test. Soldering & Surface Mount Technology. 2012; 24:120-6. (★/◆)
- [32] Chen G, Sun XH, Nie P, Mei YH*, Lu GQ, Chen X. High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films. Journal of Electronic Materials. 2012; 41:782-90. (★/◆)
- [33] Chen G, Han D, Mei YH*, Cao X, Wang T, Chen X, et al. Transient Thermal Performance of IGBT Power Modules attached by Low-Temperature Sintered Nano-Silver., IEEE Transactions on Device and Materials Reliability. 2012; 12(1): 124-32. (★/◆)
- [34] Chen G, Shan SC, Chen X*, Yuan H. Ratcheting and fatigue properties of the high-nitrogen steel X13CrMnMoN18-14-3 under cyclic loading. Computational Materials Science. 2009; 46: 572-8. (★/◆) IF: 2.086
- [35] Chen G, Chen X*, Kim KS, Abdel-Karim M, Sakane M. Strain rate dependent constitutive model of multiaxial ratchetting of 63Sn–37Pb solder. ASME Transaction on Journal of Electronic Packaging. 2007; 129: 278. (★/◆) IF: 1.402
- [36] Chen G, Chen X*. Fatigue damage coupled constitutive model for 63Sn37Pb solder under proportional and non-proportional loading. Mechanics of materials. 2007; 39:11-23. (★/◆)
- [37] Chen G, Chen X*, Niu CD. Uniaxial ratcheting behavior of 63Sn37Pb solder with loading histories and stress rates. Materials Science & Engineering: A. 2006; 421: 238-44. (★/◆)
- [38] Chen G, Chen X*. Constitutive and damage model for 63Sn37Pb solder under uniaxial and torsional cyclic loading. International journal of solids and structures. 2006;43:3596-612. (★/◆) IF: 2.081
- [39] Chen G, Chen X*. Finite element analysis of fleXBGA reliability. Soldering & Surface Mount Technology. 2006; 18(2): 46-53. (★/◆)