Mei YH, Chen G*, Li X, Lu GQ, Chen X. Evolution of Curvature under Thermal Cycling in Sandwich Assembly Bonded by Sintered Nano-silver Paste, Soldering & Surface Mount Technology. 2013; 25(2): 107-116. (★/◆) IF: 0.913
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上一条:Chen G, Zhang ZS, Mei YH*, Li X, Lu GQ, Chen X. Ratcheting Behavior of Sandwiched Assembly Joined by Sintered Nanosilver for Power Electronics Packaging. Microelectronics Reliability. 2013; 53(4): 645-651. (★/◆) IF: 1.202
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