Li X, Chen G*, Wang L, Mei YH, Chen X, Lu GQ. Creep Properties of Low-Temperature Sintered Nano-Silver Lap Shear Joints. Materials Science & Engineering A. 2013; 579: 108-113. (★/◆)
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上一条:Mei YH, Cao YJ, Chen G*, Li X, Lu GQ, Chen X. Characterization and Reliability of Sinter Nanosilver Joints by A Rapid Current-Assisted Method for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2014; 14(1): 262-267. (★/◆) IF: 1.437
下一条:Mei YH, Chen G*, Cao YJ, Li X, Han D, Chen X. Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging. Journal of Electronic Materials, 2013; 42(6): 1209-1218. (★/◆) IF: 1.491
