Chen G, Yu L, Mei YH*, Li X, Chen X, Lu GQ. Reliability Comparison between SAC305 Joint and Sintered Nanosilver Joint at High Temperatures for Power Electronic Packaging. Journal of Materials Processing Technology. 2014; 214(9): 1900-1908. (★/◆) IF: 2.359
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上一条:Chen G, Zhang ZS, Mei YH*, Li X, Yu DJ, Wang L, Chen X. Applying Viscoplastic Constitutive Models to Predict Ratcheting Behavior of Sintered Nanosilver Lap-Shear Joint. Mechanics of Materials. 2014; 72: 61-71. (★/◆) IF: 2.636
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