[12] X.Y. Wang, Q. Cheng, X.P. Ma et al，Improvement of reliability for high-ohmic Cr–Si thin film resistors in a heat and humid environment: Removing moisture source by electrocatalytic decomposition of water. Microelectronics Reliability, 60(2016)101–108.

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上一条:[11] X.Y. Wang, Y.P. Liu, B.N. Ding et al, Mechanism on M (M=Ni, Mo, Ni-Mo) as deep level impurity reducing the TCR of Si-rich Cr-Si resistive films. Superlattices and Microstructures, 109(2017) 217–229. 下一条:[13] X.Y. Wang, H. Zhang, X.P. Ma et al，Degradation behavior and mechanism of polymer films for high-ohmic resistor protection in a heat and humid environment. Microelectronics Reliability, 57 (2016) 79–85.