[13] X.Y. Wang, H. Zhang, X.P. Ma et al，Degradation behavior and mechanism of polymer films for high-ohmic resistor protection in a heat and humid environment. Microelectronics Reliability, 57 (2016) 79–85.

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上一条:[12] X.Y. Wang, Q. Cheng, X.P. Ma et al，Improvement of reliability for high-ohmic Cr–Si thin film resistors in a heat and humid environment: Removing moisture source by electrocatalytic decomposition of water. Microelectronics Reliability, 60(2016)101–108. 下一条:[14] X.Y. Wang, J.X. Ma, C.G. Li et al, Thermosetting polyimide resin matrix composites with interpenetrating polymer networks for precision foil resistor chips based on special mechanical performance. Applied Surface Science，299(2014)73–80.