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李海龙

  • 教师名称:李海龙
  • 教师拼音名称:Li Hailong
  • 出生日期:1984-02-18
  • 性别:
  • 职称:讲师

其他联系方式

  • 邮箱:
  • 基本信息

  • 研究方向

  • 获奖情况

  • 论文成果

  • Areas of research interest


    1. Electronics Packaging Technology< br>2. Micro-/Nano-Joining Technology< br>3. Reliability Testing and Analysis< br>4. Numerical Simulation


    Selected publications (Journal articles, patents and books)


    [1]Hailong Li, Rong An, Chunqing Wang, et al. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing [J]. Mater Lett, 2015, 158(0): 252-4.< br>[2]Hailong Li, Rong An, Chunqing Wang, et al. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging [J]. J Alloy Compd, 2015, 634(0): 94-8.< br>[3]Hailong Li, Rong An, Chunqing Wang, et al. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints [J]. Mater Lett, 2015, 144(0): 97-9.


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教育经历

  • 2005.9-2009.7 Harbin Institute of Technology   Welding Science and Engineering   学士
  • 2009.9-2011.7 Harbin Institute of Technology   Materials Processing Engineering   硕士
  • 2011.9-2015.10 Harbin Institute of Technology   Materials Processing Engineering   博士

工作经历

  • 2015.12 -2019.12

    |School of Materials Science and Engineering|Tianjin University|Lecturer

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