School of Materials Science and Engineering
Lecturer
dragoneptech@163.com
Areas of research interest
1. Electronics Packaging Technology< br>2. Micro-/Nano-Joining Technology< br>3. Reliability Testing and Analysis< br>4. Numerical Simulation
Selected publications (Journal articles, patents and books)
[1]Hailong Li, Rong An, Chunqing Wang, et al. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing [J]. Mater Lett, 2015, 158(0): 252-4.< br>[2]Hailong Li, Rong An, Chunqing Wang, et al. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging [J]. J Alloy Compd, 2015, 634(0): 94-8.< br>[3]Hailong Li, Rong An, Chunqing Wang, et al. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints [J]. Mater Lett, 2015, 144(0): 97-9.
- Bachelor’s Degree| Harbin Institute of Technology| Welding Science and Engineering| 2009
- Master’s Degree| Harbin Institute of Technology| Materials Processing Engineering| 2011
- Doctoral degree| Harbin Institute of Technology| Materials Processing Engineering| 2015
- Electronics Packaging Technology
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2015.12-2019.12
School of Materials Science and Engineering | Tianjin University | Lecturer