Fujun Wang
School
School of Mechanical Engineering
Professional Title
Associate professor
Administrative Appointments
Mechanical Engineering
Contact Information
wangfujun@tju.edu.cn
School of Mechanical Engineering (Room 247, Building 37), Yaguan Road 135, Tianjin University, Haihe Education Park, Tianjin 300054, China
Brief Introduction
Fujun Wang is currently associate professor in the School of Mechanical Engineering, Tianjin University. He received the Ph.D. degrees in Mechanical Engineering from Tianjin University, Tianjin, China, in 2010. He became an assistant professor in the School of Mechanical Engineering, Tianjin University in 2010. From Dec. 2013 to Dec. 2014, he was a research scholar in the Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems, Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, USA. Since 2015, His current research interests include dynamics and control, compliant/soft actuator and mechanism, micro/nano manipulation robots and equipment, and micro/nano manufacturing.
Education Background
- PhD| Tianjin University| Mechanical Engineering| 2010
- MSc| Tianjin University| Mechanical Engineering| 2007
- BSc| Hebei University of Technology| Mechanical Engineering| 2005
Research Interests
- Dynamics and Control
- Micro/Nano Manufacturing
- Compliant/Soft Actuator and Mechanism
Positions & Employments
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2015.6-2019.12
School of Mechanical Engineering | Tianjin University | Associate Professor -
2010.10-2015.6
School of Mechanical Engineering | Tianjin University | Assistant Professor -
2013.12-2014.12
Department of Mechanical Science and Engineering | University of Illinois at Urbana-Champaign | Visiting Scholar
Academic Achievements
- Papers
- [1] Liang C., Wang F.*, Tian Y., Zhao X., Zhang D. (2017) Grasping force hysteresis compensation of a piezoelectric-actuated wire clamp with a modified inverse Prandtl-Ishlinskii model, Review of Scientific Instruments, Doi: 10.1063/1.5009183.
- [2] Liang C., Wang F.*, Yang Q., Tian Y., Zhao X., Zhang D. (2017) Design and characteristic analysis of an aerostatic decoupling table for microelectronic packaging, PIMechE, Part C, Journal of Mechanical Engineering Science. DOI: 10.1177/0954406217698723.
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- [3] Liang C., Wang F.*, Tian Y., Zhao X., Zhang D. (2017) Development of a high speed and precision wire clamp with both position and force regulations, Robotics and Computer-Integrated Manufacturing, 44: 208-217.
- [4] Tian Y., Bao Y. Wang F.*, Cai K., Yang C., Zhang D. (2017) Design and control of a flexible positioning stage driven by voice coil motors, Transactions of Tianjin University, 10: 1070-1076. (In Chinese)
- [5] Guo Z., Tian Y.*, Liu X. , Wang F., Zhou C., Zhang D. (2017) Modeling and simulation of the probe tip based nanochannel scratching, Precision Engineering, 49: 136-145.
- [6] Guo Z., Tian Y.*, Tian J., Liu X. , Wang F., Zhang H., Zhang D. (2017) Probe system design for three dimensional micro/nano scratching machine, Microsystem Technologies, 23: 2285–2295.
- [7] Guo Z., Tian Y.*, Liu X., Wang F., Zhou C., Zhang D. (2017) Experimental investigation of the tip based micro/nano machining, Applied Surface Science, 426: 406–417.
- [8] Yang Z., Tian Y., Yang C.*, Wang F., Liu X. (2017) Modification of wetting property of Inconel 718 surface by nanosecond laser texturing, Applied Surface Science, 414: 313–324.
- [9] Zhu J., Tian Y., Yang C.*, Cui L., Wang F., Zhang D., Liu X. (2017) Low-cost and fast fabrication of the ultrasonic embossing on polyethylene terephthalate (PET) films using laser processed molds, Microsystem Technologies, Doi: 10.1007/s00542-017-3369-x.
- [10] Wang F.*, Zhang H., Liang C., Tian Y., Zhao X., and Zhang D. (2016): Design of high frequency ultrasonic transducers with flexure decoupling flanges for thermosonic bonding, IEEE Transactions on Industrial Electronics, 63(4): 2304-2312.
- [11] Wang F.*, Liang C., Tian Y., Zhao X., and Zhang D. (2016): Design and control of a compliant microgripper with a large amplification ratio for high-speed micro manipulation, IEEE/ASME Transactions on Mechatronics, 21(3): 1262-1271.
- [12] Wang F.*, Liang C., Tian Y., Zhao X., and Zhang D. (2016): A flexure-based kinematically decoupled micropositioning stage with a centimeter range dedicated to micro/nano manufacturing, IEEE/ASME Transactions on Mechatronics, 21(2): 1055-1062.
- [13] Tian Y., Liu Y., Wang F.*, Jing X., Zhang D., Liu X. (2016): Modeling and analyses of helical milling process, International Journal of Advanced Manufacturing Technology, 90: 1-20.
- [14] Han L.*, and Wang F. (2016): A general torsional stiffness estimating approach for geared transmission employed in rotary table of machine tools, Journal of Advanced Mechanical Design, Systems, and Manufacturing, 10(2): 16-00020.1-16.
- [15] Cai K., Tian Y.*, Wang F., Zhang D., and Shirinzadeh B. (2016): Development of a piezo-driven 3-DOF stage with T-shape flexible hinge mechanism, Robotics and Computer-Integrated Manufacturing, 37: 125-138.
- [16] Wang F.*, Liang C., Tian Y., Zhao X., and Zhang D. (2015): Design of a piezoelectric- actuated microgripper with a three-stage flexure-based amplification, IEEE/ASME Transactions on Mechatronics, 20(5): 2205-2213.
- [17] Wang F., Ma Z., Gao W.*, Zhao X., Tian Y., Zhang D., and Liang C. (2015): Dynamic modeling and control of a novel XY positioning stage for semiconductor packaging, Transactions of the Institute of Measurement and Control, 37(2): 177-189.
- [18] Wang F.*, Zhang H., Liang C., Tian Y., Zhao X., Zhang D. (2015): Note: Decoupling design for high frequency piezoelectric ultrasonic transducers with their clamping connections, Review of Scientific Instruments, 86: 126111.1-3.
- [19] Liang C., Wang F.*, Tian Y., Zhao X., Zhang H., Cui L., Zhang D., and Ferreira P. (2015): A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging, Review of Scientific Instruments, 86: 045106.1-10.
- [20] Zhang H., Wang F.*, Zhang D., Wang L., Hou Y., and Xi T. (2015): A new automatic resonance frequency tracking method for piezoelectric ultrasonic transducers used in thermosonic bonding, Sensors and Actuators: A-Physical, 235: 140-150.
- [21] Zhang H.*, Wang F., Xi T., Zhao J., Wang L., and Gao W. (2015): A novel quality evaluation method of resistance spot welding based on the electrode displacement signal and Chernoff faces technique, Mechanical Systems and Signal Processing, 62: 431-443.
- [22] Guo Z., Tian Y.*, Liu C., Wang F., Liu X., and Zhang D. (2015): Design and control methodology of a 3-DOF flexure-based mechanism for micro/nano positioning, Robotics and Computer Integrated Manufacturing, 32: 93-105.
- [23] Tian Y.*, Liu C., Liu X., Wang F., Li X., Qin Y., Zhang D., and Shirinzadeh B. (2015): Design, modeling and characterization of a 2-DOF precision positioning platform, Transactions of the Institute of Measurement and Control, 37(3): 396-405.
- [24] Shang J., Tian Y.*, Li Z., Wang F., Cai K. (2015): A novel voice coil motor-driven compliant micropositioning stage based on flexure mechanism, Review of Scientific Instruments, 86 (9): 095001.
- [25] Wang F.*, Li J., Liu S., Zhao X., Zhang D., and Tian Y. (2014): An improved adaptive genetic algorithm for image segmentation and vision alignment used in microelectronic bonding, IEEE/ASME Transactions on Mechatronics, 19(3): 916-923.
- [26] Zhang H.*, Wang F., Gao W., and Hou Y. (2014): Quality assessment for resistance spot welding based on binary image of electrode displacement signal and probabilistic neural network, Science and Technology of Welding and Joining, 19(3): 242-249.
- [27] Liang C., Wang F*., Zhang D., Zhao X., Tian Y. (2014): Characteristic analysis of a 2-DOF air-supported precision positioning table for microelectronic ultrasonic bonding, Transactions of the China welding institution, 2014, 35(6): 77-80. (In Chinese)
- [28] Tian Y.*, Li Z., Gao W., Cai K., Wang F., Zhang D., Shirinzadeh B., Fatikow S. (2014): Mechanical properties investigation of monolayer h-BN sheet under in-plane shear displacement using molecular dynamics simulations, Journal of Applied Physics, 115(1): 014308.
- [29] Han L.*, Zhang D., Tian Y., Wang F., and Xiao H. (2014): Static stiffness modeling and sensitivity analysis for geared system used for rotary feeding, PIMechE, Part C, Journal of Mechanical Engineering Science, 228(8): 1431-1443.
- [30] Zhang H., Wang F.*, Zhao X, Zhang D., and Tian Y. (2013): Electrical matching of a piezoelectric ultrasonic transducer for microelectronic bonding, Sensors and Actuators A: Physical, 199(1): 241-249.
- [31] Li X., Tian Y.*, Qin Y., Wang F., Gao W., Zhang D., Eichhorn V., Fatikow S. (2013): Design, identification and control of a 2-DOF flexure-based mechanism for micro/nano manipulation, Nanoscience and Nanotechnology Letters, 5(9): 960-967.
- [32] Tian Y.*, Guo Z., Wang F., Li J., Zhang D. (2013): Design and experimental investigation of a 2-DOF planar micro-positioning table, International Journal of Intelligent Mechatronics and Robotics, 3(2): 39-54.
- [33] Han L., Niu W.*, Zhang D., Wang F. (2013): An improved algorithm for calculating friction force and torque in involute helical gears, Mathematical Problems in Engineering, 575302.
- [34] Han L.*, Zhang D., Wang F. (2013): Predicting film parameter and friction coefficient for helical gears considering surface roughness and load variation, Tribology Transactions, 56(1): 49-57.
- [35] Wang F.*, Zhao X., Zhang D., Ma Z., Jing X. (2011): Robust and precision control for a directly driven XY table, Proceedings of IMechE, Part C, Journal of Mechanical Engineering Science, 225(5): 1107-1120.
- [36] Wang F.*, Zhao X., Zhang D., and Wu Y. (2010): Design and control of a directly-driven bond head for thermosonic bonding, Proceedings of IMechE, Part C, Journal of Mechanical Engineering Science, 224(4): 805-815.
- [37] Wang F.*, Zhao X., Zhang D., Wu Y., Shirinzadeh B., Tian Y. (2010): Design and control of a high-acceleration precision positioning system with a novel flexible decoupling mechanism, Proceedings of IMechE, Part C, Journal of Mechanical Engineering Science, 224(2): 431-442.
- [38] Wang F.*, Zhao X., Zhang D., Wu Y. (2009): Development of novel ultrasonic transducers for microelectronics packaging, Journal of Materials Processing Technology, 209(3): 1291-1301.
- [39] Wang F.*, Mao H., Zhang D., .Zhao X. (2009): The crack control during laser cladding by adding the stainless steel net in the coating, Applied Surface Science, 255(21): 8846-8854.
- [40] Wang F.*, Mao H., Zhang D., Zhao X., Shen Y. (2008): Online study of cracks during laser cladding process based on acoustic emission technique and finite element analysis, Applied Surface Science, 255(5): 3267-3275.
- Patents
- [1] Wang F., Zhou K., Liang C., Tian Y., Zhang D. (2017): A piezo-actuated microgripper with three-stage displacement amplifier, Submitted as: Chinese Patent (Application No: 2017107122893, application date 8. 2017)
- [2] Shi B., Wang F., Liang C., Tian Y., Zhang D. (2017): A high precision 2-DOF microgripper actuated by a piezoelectric actuator, Submitted as: Chinese Patent (Application No: 2017107118455, application date 8. 2017)
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- [3] Huo Z., Wang F., Liang C., Tian Y., Zhang D. (2017): An actuating force decoupled 3-DOF micro-positioning stage with long travel ranges, Submitted as: Chinese Patent (Application No: 2017107061669, application date 8. 2017)
- [4] Liang C., Wang F., Tian Y., Zhang D. (2017): A 2-DOF decoupled micro-rotation platform actuated by a piezoelectric actuator , Submitted as: Chinese Patent (Application No: 2017107128279, application date 8. 2017)
- [5] Zhou C., Tian Y., Wang F., Guo Z., Zhang D. (2017): A high precision and ultra micro force electromagnetic actuator, Submitted as: Chinese Patent (Application No: 2017106809333, application date 8. 2017)
- [6] Wang F., Zhao X., Zhang D., Wu Y. (2016): High frequency ultrasonic transducers for microelectronics bonding, Chinese Patent (Patent No ZL201310465933.3)
- [7] Liang C., Wang F., Zhang D. (2016): The precision positioning stage with a novel flexure decoupling mechanism, Chinese Patent ((Patent No ZL201310465150.5)
- [8] Liang C., Wang F., Tian Y., Zhang D. (2015): High precise microgripper actuated by a piezo-actuator, Submitted as: Chinese Patent (Application No: 2015106838591, application date 10.2015)
- [9] Yuan Y., Jing X., Fang H., Zhang D., Wang F. (2015): A 2D ultrasonic vibration stage, Submitted as: Chinese Patent (Application No: 2015100118652, application date 10. 2015)
- [10] Wang F., Zhao X., Zhang D., Wu Y. (2012): The ultrasonic transducer for microelectronics wire bonder with multi-frequency, Chinese Patent (Patent No ZL200910245182.8).