Chen G, Sun XH, Nie P, Mei YH*, Lu GQ, Chen X. High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films. Journal of Electronic Materials. 2012; 41:782-90. (★/◆)
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上一条:Li X, Chen G*, Chen X, Lu GQ, Wang L, Mei YH. Mechanical Property Evaluation of Nano-Silver Paste Sintered Joint Using Lap-Shear Test. Soldering & Surface Mount Technology. 2012; 24:120-6. (★/◆)
下一条:Chen G, Han D, Mei YH*, Cao X, Wang T, Chen X, et al. Transient Thermal Performance of IGBT Power Modules attached by Low-Temperature Sintered Nano-Silver., IEEE Transactions on Device and Materials Reliability. 2012; 12(1): 124-32. (★/◆)
