Li X, Chen G*, Chen X, Lu GQ, Wang L, Mei YH. Mechanical Property Evaluation of Nano-Silver Paste Sintered Joint Using Lap-Shear Test. Soldering & Surface Mount Technology. 2012; 24:120-6. (★/◆)
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上一条:Chen G, Cao YJ, Mei YH*, Han D, Li X, Lu GQ, Chen X. Pressures-Assisted Low-Temperature Sintering of Nanosilver Paste for 5×5 mm2 Chip Attachment, IEEE Transactions on Components and Packaging Technology. 2012; 2 (11): 1759-1767. (★/◆) IF: 1.151
下一条:Chen G, Sun XH, Nie P, Mei YH*, Lu GQ, Chen X. High-Temperature Creep Behavior of Low-Temperature-Sintered Nano-Silver Paste Films. Journal of Electronic Materials. 2012; 41:782-90. (★/◆)
