School of Microelectronics
Engineer
微电子学与固体电子学
13821895951
kuibo.lan@tju.edu.cn
School of microelectronic, Tianjin University Weijin Rd, Nankai District 300072, Tianjin, P.R. China
300072
Mainly engaged in the preparation and characterization of microelectronics metal film and dielectric film; in the preparation and electrical characteristics improvement of one dimensional conductive materials. Chip failure analysis and reliability research.
As participants completed two national natural science fund (Great interconnection scale integrated circuit carbon nanotubes and key technology research, project number: 60806030; Resistance of carbon nanotube electrodes cross array variable storage unit and switch characteristic research, project number: 61274113), One key projects of Tianjin science and technology plan (Directional carbon nanotubes vertical interconnect integrated circuit technology research, project number: 10SYSYJC27700).
- Master of engineering| Tianjin university of technology| Microelectronics and solid-state electronics| 2014
- Bachelor of engineering| Tianjin university of technology| Integrated circuit design and system| 2011
- Chip failure analysis and reliability research.
- The preparation and electrical characteristics improvement of one dimensional conductive materials.
- 薄膜电子和柔性电子器件
- 全国大学生集成电路创新创业大赛信诺达杯分赛区评委
- 曹妃甸产教融合协同育人实训基地特聘顾问
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2015.9-2019.12
School of microelectronics | Tianjin university | Engineer  -
2014.3-2015.8
Quality | Freescale semiconductor (China) co., LTD | Party branch secretary | Engineer 
- Papers
- [1] Method of Precise Positioning for Defect Failure Analysis Based on Nano-Probing and EBAC
- [2] Flexible silicon nanowires sensor for acetone detection on plastic substrates
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- [3] Open circuit defect positioning method based on dynamic photon emission microscopy and schematic analysis for mixed signal IC on SOI
- [4] 实验教学示范中心的新工科建设探索与实践
- [5] 集成电路光刻工艺虚拟仿真实验教学建设
- [6] 微电子专业生产实习教学模式的探索与实践
- [7] 基于正交实验法的微电子工艺实验教学研究
- [8] Improvement of Electronic Characteristic for Vertical CNTVia Interconnection by Focused Ion Beam