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陈刚
- 教师拼音名称：Chen Gang
- 出生日期：1979-02-26
- 性别：男
- 职称：教授
- 所属院系：化工学院
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· Mei YH, Cao YJ, Chen G*, Li X, Lu GQ, Chen X. Characterization and Reliability of Sinter Nanosilver Joints by A Rapid Current-Assisted Method for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2014; 14(1): 262-267. (★/◆) IF: 1.437
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· Li X, Chen G*, Wang L, Mei YH, Chen X, Lu GQ. Creep Properties of Low-Temperature Sintered Nano-Silver Lap Shear Joints. Materials Science & Engineering A. 2013; 579: 108-113. (★/◆)
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· Mei YH, Chen G*, Cao YJ, Li X, Han D, Chen X. Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging. Journal of Electronic Materials, 2013; 42(6): 1209-1218. (★/◆) IF: 1.491
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· Mei YH, Cao YJ, Chen G*, Li X, Lu GQ, Chen X. Rapid Sintering Nanosilver Joint by Pulse-Current for Power Electronics Packaging. IEEE Transactions on Device and Materials Reliability. 2013;13(1): 258-265. (★/◆)
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· Chen G, Zhang ZS, Mei YH*, Li X, Lu GQ, Chen X. Ratcheting Behavior of Sandwiched Assembly Joined by Sintered Nanosilver for Power Electronics Packaging. Microelectronics Reliability. 2013; 53(4): 645-651. (★/◆) IF: 1.202
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· Mei YH, Chen G*, Li X, Lu GQ, Chen X. Evolution of Curvature under Thermal Cycling in Sandwich Assembly Bonded by Sintered Nano-silver Paste, Soldering & Surface Mount Technology. 2013; 25(2): 107-116. (★/◆) IF: 0.913
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· Wen MJ, Li H, Yu DJ, Chen G*, Chen X. Uniaxial ratcheting behavior of Zircaloy-4 tubes at room temperature. Materials & Design. 2013; 46, 426-434. (★/◆) IF: 3.997
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· Li X, Chen G*, Chen X, Lu GQ, Wang L, Mei YH. High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. Microelectronics Reliability. 2013; 53(1): 174-181. (★/◆)
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· Mei YH, Wang T, Cao X, Chen G*, Lu GQ, Chen X. Transient Thermal Impedance Measurement on Low-Temperature Sintered Nano-silver Joints. Journal of Electronic Materials. 2012; 41 (11) : 3152-3160. (★/◆)
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· Chen G, Cao YJ, Mei YH*, Han D, Li X, Lu GQ, Chen X. Pressures-Assisted Low-Temperature Sintering of Nanosilver Paste for 5×5 mm2 Chip Attachment, IEEE Transactions on Components and Packaging Technology. 2012; 2 (11): 1759-1767. (★/◆) IF: 1.151
